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전체선택

Integration of plasma dicing in the collective die to wafer hybrid bonding process

회의자료

issue: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :144-149 Dec, 2023
Author: Suhard, Samuel
Kennes, Koen
Bex, Pieter
Georgieva, Violeta
Schleicher, Filip
Walsby, Edward
Barnett, Richard
Jourdain, Anne
Beyer, Gerald
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Process Challenges During CVD Oxide Deposition on the Backside of $20-\mu m$ Thin 300-mm Wafers Temporarily Bonded to Glass Carriers

회의자료

issue: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1584-1589 May, 2023
Author: Kennes, Koen
Guerrero, Alice
Salahouelhadj, Abdellah
Suhard, Samuel
Derakhshandeh, Jaber
Phommahaxay, Alain
Brems, Steven
Beyer, Gerald
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Carrier Systems for Collective Die-to-Wafer Bonding

회의자료

issue: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :2058-2063 May, 2022
Author: Kennes, Koen
Phommahaxay, Alain
Guerrero, Alice
Suhard, Samuel
Bex, Pieter
Brems, Steven
Liu, Xiao
Tussing, Sebastian
Beyer, Gerald
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Acoustic modulation during laser debonding of collective hybrid bonded dies

회의자료

issue: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2126-2133 Jun, 2021
Author: Kennes, Koen
Phommahaxay, Alain
Guerrero, Alice
Bumueller, Dennis
Suhard, Samuel
Bex, Pieter
Tussing, Sebastian
Liu, Xiao
Beyer, Gerald
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Demonstration of a collective hybrid die-to-wafer integration using glass carrier

회의자료

issue: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2064-2070 Jun, 2021
Author: Suhard, Samuel
Kennes, Koen
Bex, Pieter
Jourdain, Anne
Teugels, Lieve
Walsby, Edward
Bolton, Chris
Patel, Jash
Ashraf, Huma
Barnett, Richard
Fodor, Ferenc
Phommahaxay, Alain
La Tulipe, Douglas
Beyer, Gerald
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Demonstration of a collective hybrid die-to-wafer integration

회의자료

issue: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1315-1321 Jun, 2020
Author: Suhard, Samuel
Phommahaxay, Alain
Kennes, Koen
Bex, Pieter
Fodor, Ferenc
Liebens, Maarten
Slabbekoorn, John
Miller, Andy
Beyer, Gerald
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Introduction of a New Carrier System for Collective Die-to-Wafer Hybrid Bonding and Laser-Assisted Die Transfer

회의자료

issue: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :296-302 Jun, 2020
Author: Kennes, Koen
Phommahaxay, Alain
Guerrero, Alice
Bauder, Olga
Suhard, Samuel
Bex, Pieter
Iacovo, Serena
Liu, Xiao
Schmidt, Thomas
Beyer, Gerald
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Process Complexity and Cost Considerations of Multi-Layer Die Stacks

회의자료

issue: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-6 Oct, 2019
Author: Velenis, Dimitrios
De Vos, Joeri
Kim, Soon-Wook
Derakhshandeh, Jaber J.
Bex, Pieter
Capuz, Giovanni
Suhard, Samuel
Rebibis, Kenneth June
Van Huylenbroeck, Stefaan
Jan Marinissen, Erik
Phommahaxay, Alain
Miller, Andy
Beyer, Gerald
Van der Plas, Geert
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Protective Layer for Collective Die to Wafer Hybrid Bonding

회의자료

issue: 2019 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2019 International. :1-4 Oct, 2019
Author: Inoue, Fumihiro
Bertheau, Julien
Suhard, Samuel
Phommahaxay, Alain
Ohashi, Takuya
Kinoshita, Tetsuro
Kinoshita, Yohei
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

New approach to apply 1,2,3-benzotriazole as a capping layer on UBMs for 3D TCB stacking and investigation of oxidation protection and solder wetting

회의자료

issue: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-8 Sep, 2019
Author: Shehzad, Adil
Derakhshandeh, Jaber
Wunderle, Bernhard
Hou, Lin
Suhard, Samuel
Rebibis, Kenneth June
Miller, Andy
Beyer, Gerald
Beyne, Eric
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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