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전체선택

Reliability study of Au-Al wire bond under Cl environment

회의자료

issue: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022
Author: Liao, Jinzhi Lois
Wang, Bisheng
Zhang, Xi
Hua, Younan
Li, Xiaomin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Chlorine effect on copper bonding wire reliability

회의자료

issue: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-4 Jul, 2022
Author: Liao, Jinzhi Lois
Wang, Bisheng
Zhang, Xi
Hua, Younan
Li, Xiaomin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Sparse Message Passing Network with Feature Integration for Online Multiple Object Tracking

보고서

Author: Wang, Bisheng
Possegger, Horst
Bischof, Horst
Cao, Guo
DB Label: Database : arXiv

원문보기: Open Access (Arxiv)

Atmospheric corrosion of Ag/Cu plated FeNi based leadframe used in MOSFET package

회의자료

issue: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-4 Sep, 2021
Author: Liao, Lois Jinzhi
Wang, Bisheng
Cai, Juanlu
Zhang, Tao
Liu, Jing
Binhai, Liu
Zhang, Xi
Hua, Younan
Li, Xiaomin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Air pollutant prediction model based on transfer learning two-stage attention mechanism.

학술저널

issue: Scientific Reports. 3/28/2024, Vol. 14, p1-18. 18p.
Author: Ma, Zhanfei^1,2 (AUTHOR)
Wang, Bisheng² (AUTHOR) ambitious0913@163.com
Luo, Wenli² (AUTHOR)
Jiang, Jing² (AUTHOR)
Liu, Dongxiang¹ (AUTHOR)
Wei, Hui² (AUTHOR)
Luo, HaoYe¹ (AUTHOR)
DB Label: Database : Academic Search Complete

원문보기: Full Text (원문보기) Full Text (원문보기) OA (Nature) OA (Springer) 조회 - Impact Factor (JCR) 등재 - Web of Science (SCIE) 등재 - SCOPUS

Comprehensive study of wire bond reliability impacts from wire, molding compound and bond pad contamination

회의자료

issue: 2019 International Conference on IC Design and Technology (ICICDT) IC Design and Technology (ICICDT), 2019 International Conference on. :1-6 Jun, 2019
Author: Liao, Lois Jinzhi
Zhang, Xi
Li, Xiaomin
Hua, Younan
Fu, Chao
Tee, Weikok
Yee, Boonhwa
Wang, Bisheng
Mao, Songlin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Fatigue Life Analysis and Its Correction Coefficient of Stress Intensity Factor for Selectively Repaired Structure

회의자료

issue: 2019 International Conference on Intelligent Transportation, Big Data & Smart City (ICITBS) ICITBS Intelligent Transportation, Big Data & Smart City (ICITBS), 2019 International Conference on. :556-559 Jan, 2019
Author: Liao, Yashi
Li, Yibo
Huang, Minghui
Li, Jian
Wang, Bisheng
Hu, Yun
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Strong links between aggregate stability, soil carbon stocks and microbial community composition across management practices in a Chinese dryland cropping system

학술저널