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전체선택

Low-temperature die attach for power components: Cu-Sn-In solid-liquid interdiffusion bonding

회의자료

issue: 2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM) Advanced Semiconductor Devices and Microsystems (ASDAM), 2022 14th International Conference on. :1-6 Oct, 2022
Author: Emadi, F.
Liu, S.
Klami, A.
Tiwary, N.
Vuorinen, V.
Paulasto-Krockel, M.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

학술저널

issue: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 70(1):222-229 Jan, 2023
Author: Tiwary, N.
Ross, G.
Vuorinen, V.
Paulasto-Krockel, M.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 등재 - Web of Science (SCIE)

Finite Element Simulation of Solid–Liquid Interdiffusion Bonding Process: Understanding Process-Dependent Thermomechanical Stress

학술저널

issue: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(5):847-856 May, 2022
Author: Tiwary, N.
Vuorinen, V.
Ross, G.
Paulasto-Krockel, M.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 등재 - Web of Science (SCIE)

Demonstrating 170 °C Low-Temperature Cu–In–Sn Wafer-Level Solid Liquid Interdiffusion Bonding

학술저널

issue: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):446-453 Mar, 2022
Author: Vuorinen, V.
Ross, G.
Klami, A.
Dong, H.
Paulasto-Krockel, M.
Wernicke, T.
Ponninger, A.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 등재 - Web of Science (SCIE)

A GPU-accelerated computational fluid dynamics solver for assessing shear-driven indoor airflow and virus transmission by scale-resolved simulations

보고서

Author: Korhonen, M.
Laitinen, A.
Isitman, G. E.
Jimenez, J. L.
Vuorinen, V.
DB Label: Database : arXiv

원문보기: Open Access (Arxiv)

Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics

학술저널

issue: In Materials Science & Engineering A 10 August 2023 881
Author: Emadi, F.
Vuorinen, V.
Ross, G.
Paulasto-Kröckel, M.
DB Label: Database : ScienceDirect

원문보기: Full Text (ScienceDirect) 등재 - SCOPUS 조회 - Impact Factor (JCR) 등재 - Web of Science (SCIE)

Wafer-Level AuSn/Pt Solid–Liquid Interdiffusion Bonding

학술저널

issue: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 8(2):169-176 Feb, 2018
Author: Rautiainen, A.
Vuorinen, V.
Heikkinen, H.
Paulasto-Krockel, M.
DB Label: Database : IEEE Xplore Digital Library