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- Science Citation Index Expanded (95)
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전체선택

Interface reactions between copper and 50In-50Pb (wt%) alloy by solid-state aging

학술저널

issue: Journal of Alloys and Metallurgical Systems, Vol 5, Iss , Pp 100066- (2024)
Author: P.T. Vianco
A.C. Kilgo
B.M. McKenzie
R.L. Grant
S. Williams
DB Label: Database : Directory of Open Access Journals

원문보기: Full Text (ScienceDirect O/A) Open Access (DOAJ)

Elastic Modulus and Coefficient of Thermal Expansion of 91.84Sn-3.33Ag-4.83Bi Pb-Free Solder

학술저널

issue: Journal of Electronic Materials. 52(3):2116-2138
Author: Vianco, Paul T.^{Aff1, IDs1166402210159y_cor1}
Neilsen, Michael K.
Williams, Shelley
Bradley, Donald R.
Diebold, Thomas W.
DB Label: Database : Springer Nature Journals

원문보기: 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 원문복사신청 - RISS

Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer. Part 2: Quantitative Compositional Analysis of Intermetallic Compound Reaction Layers

학술저널

issue: Journal of Electronic Materials. 52(1):628-652
Author: Vianco, P. T.^{Aff1, IDs1166402210034w_cor1}
Kilgo, A. C.
McKenzie, B. B.
Grant, R. P.
Williams, S.
DB Label: Database : Springer Nature Journals

원문보기: 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 원문복사신청 - RISS

Impact of Gold Thickness on Interfacial Evolution and Subsequent Embrittlement of Tin–Lead Solder Joints

학술저널

issue: Journal of Electronic Materials. 51(12):7337-7352
Author: Wheeling, Rebecca^{Aff1, IDs11664022098912_cor1}
Vianco, Paul
Williams, Shelley
Jauregui, Luis
Gallis, Dorina F. Sava
DB Label: Database : Springer Nature Journals

원문보기: 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 원문복사신청 - RISS

Interface Embrittlement Between 63Sn-37Pb Solder and Au Layer—Part 1: Physical Metallurgy of Liquid-State and Solid-State Reactions

학술저널

issue: Journal of Electronic Materials. 51(11):6431-6453
Author: Vianco, P. T.^{Aff1, IDs11664022098805_cor1}
Kilgo, A. C.
McKenzie, B. M.
Grant, R. L.
Williams, S.
DB Label: Database : Springer Nature Journals

원문보기: 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 원문복사신청 - RISS

A Review of Interface Microstructures in Electronic Packaging Applications: Brazing and Welding Technologies

학술저널

issue: JOM: The Journal of The Minerals, Metals & Materials Society (TMS). 74(9):3557-3577
Author: Vianco, Paul T.^{Aff1, IDs1183702205308x_cor1}
DB Label: Database : Springer Nature Journals

원문보기: 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 원문복사신청 - FRIC

Use of the TurboSiP© software to predict the long-term reliability of solder joints on photovoltaic systems

회의자료

issue: 2013 IEEE 39th Photovoltaic Specialists Conference (PVSC) Photovoltaic Specialists Conference (PVSC), 2013 IEEE 39th. :3029-3032 Jun, 2013
Author: Vianco, P.
Holliday, M.
Neilsen, M.
Sorensen, R.
Yang, B. B.
Kilgo, A.
Rejent, J.
Grazier, M.
Johnson, J.
Granata, J.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Acceleration models, constitutive equations, and reliability of lead-free solders and joints

회의자료

issue: 53rd Electronic Components and Technology Conference, 2003. Proceedings. Electronic Components and Technology Conference, 2003. Proceedings. 53rd. :229-236 2003
Author: Lau, J.
Danksher, W.
Vianco, P.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Research trends in lead-free soldering in the US: NCMS Lead-Free Solder Project

회의자료

issue: Proceedings First International Symposium on Environmentally Conscious Design and Inverse Manufacturing Environmentally conscious design and inverse manufacturing Environmentally Conscious Design and Inverse Manufacturing, 1999. Proceedings. EcoDesign '99: First International Symposium On. :602-605 1999
Author: Artaki, I.
Noctor, D.
Mather, J.
Schroeder, S.
Napp, D.
Desantis, C.
Desaulnier, W.
Tsung-Yu Pan
Felton, L.
Palmer, M.
Rosser, J.
Felty, J.
Vianco, P.
Greaves, J.
Whitten, G.
Yun Zhu
Handwerker, C.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Compatibility of lead-free solders with lead containing surface finishes as a reliability issue in electronic assemblies

회의자료

issue: 1996 Proceedings 46th Electronic Components and Technology Conference Electronic components and technology Electronic Components and Technology Conference, 1996. Proceedings., 46th. :1172-1183 1996
Author: Vianco, P.
Rejent, J.
Artaki, I.
Ray, U.
Finley, D.
Jackson, A.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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