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    • 2024 25th international conference on thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems (eurosime), 2024 25th international conference on (2)
    • applied reconfigurable computing. architectures, tools, and applications : 19th international symposium, arc 2023, cottbus, germany, september 27-29, 2023, proceedings (1)

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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-5 Apr, 2024
Author
Trumann, Eike
Thieu, Gia Bao
Schmechel, Johannes
Weide-Zaage, Kirsten
Wolff, Dorian von
Bausen, Andre
Muller, Alexander
Paya-Vaya, Guillermo
DB Label
Database : IEEE Xplore Digital Library
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2024 25th International Conference on. :1-4 Apr, 2024
Author
Weide-Zaage, Kirsten
Mandala, Satria-Jaya
Trumann, Eike
Paya-Vaya, Guillermo
Wolff, Dorian von
Bausen, Andre
Muller, Alexander
DB Label
Database : IEEE Xplore Digital Library
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3

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issue
Applied Reconfigurable Computing. Architectures, Tools, and Applications : 19th International Symposium, ARC 2023, Cottbus, Germany, September 27–29, 2023, Proceedings. 14251:357-360
Author
Trumann, EikeAff11
Thieu, Gia BaoAff11
Schmechel, JohannesAff11
Weide-Zaage, KirstenAff12
Schmidt, KatharinaAff13
Hagenah, DorianAff13
Payá Vayá, GuillermoAff11
DB Label
Database : Springer Nature eBooks
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