전남대학교 중앙도서관

Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test

회의자료

issue: 2014 International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2014 International. :1-7 Dec, 2014
Author: Temple, Dorota S.
Malta, Dean
Vick, Erik P.
Lueck, Matthew R.
Goodwin, Scott H.
Muzilla, Mark S.
Masterjohn, Christopher M.
Skokan, Mark R.
DB Label: Database : IEEE Xplore Digital Library

High Efficiency Thin Film Superlattice Thermoelectric Cooler Modules Enabled by Low Resistivity Contacts

보고서

Author: He, Yuping
Léonard, François
Medlin, Douglas L.
Baldasaro, Nicholas
Temple, Dorota S.
Barletta, Philip
Spataru, Catalin D.
DB Label: Database : arXiv

High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 μm pitch

회의자료

issue: 2013 IEEE International 3D Systems Integration Conference (3DIC) 3D Systems Integration Conference (3DIC), 2013 IEEE International. :1-5 Oct, 2013
Author: Lueck, Matthew R.
Gregory, Chris W.
Malta, Dean
Huffman, Alan
Lannon, John M.
Temple, Dorota S.
DB Label: Database : IEEE Xplore Digital Library

High density metal-metal interconnect bonding with pre-applied fluxing underfill

회의자료

issue: 2012 IEEE 62nd Electronic Components and Technology Conference Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd. :20-25 May, 2012
Author: Gregory, Christopher
Lueck, Matthew
Huffman, Alan
Lannon, John M.
Temple, Dorota S.
DB Label: Database : IEEE Xplore Digital Library

Vias-last process technology for thick 2.5D Si interposers

회의자료

issue: 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International. :1-4 Jan, 2012
Author: Vick, Erik
Goodwin, Scott
Cunnigham, Garry
Temple, Dorota S.
DB Label: Database : IEEE Xplore Digital Library

Acoustic inspection of high-density-interconnects for 3D-integration

회의자료

issue: 2011 IEEE International Ultrasonics Symposium Ultrasonics Symposium (IUS), 2011 IEEE International. :1076-1079 Oct, 2011
Author: Brand, Sebastian
Petzold, Matthias
Czurratis, Peter
Reed, Jason D.
Lueck, Matthew
Gregory, Chris
Huffman, Alan
Lennon, John M.
Temple, Dorota S.
DB Label: Database : IEEE Xplore Digital Library

High resolution acoustical imaging of high-density-interconnects for 3D-integration

회의자료

issue: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :37-42 May, 2011
Author: Brand, Sebastian
Petzold, Matthias
Czurratis, Peter
Reed, Jason D.
Lueck, Matthew
Gregory, Chris
Huffman, Alan
Lannon, John M.
Temple, Dorota S.
DB Label: Database : IEEE Xplore Digital Library

Innovative practices on design & test for flexible hybrid electronics

회의자료

issue: 2018 IEEE 36th VLSI Test Symposium (VTS) VLSI Test Symposium (VTS), 2018 IEEE 36th. :1-1 Apr, 2018
Author: Huang, Tsung-Ching Jim
Marsh, Jason
Goodwin, Scott H.
Temple, Dorota S.
DB Label: Database : IEEE Xplore Digital Library

Wafer-to-wafer bonding for hermetic and vacuum packaging of smart sensors

회의자료

issue: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2017 5th International Workshop on. :10-10 May, 2017
Author: Temple, Dorota S.
Hilton, Allan
DB Label: Database : IEEE Xplore Digital Library

Scaling of 3D interconnect technology incorporating metal-metal bonds to pitches of 10 microns and below for infrared focal plane array applications

회의자료

issue: 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on. :7-7 Jul, 2014
Author: Temple, Dorota S.
Vick, Erik P.
Lueck, Matthew R.
Malta, Dean
DB Label: Database : IEEE Xplore Digital Library

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