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전체선택

Development of Solder Deterioration Diagnosis System of a Power Module via the Acoustic Emission Monitoring (AEM) Technique

회의자료

issue: 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2021 33rd International Symposium on. :179-182 May, 2021
Author: Zhang, Zheng
Suetake, Aiji
Chen, Chuantong
Ishino, Hiroshi
Sampei, Hirokazu
Endo, Takeshi
Sugiura, Kazuhiko
Tsuruta, Kazuhiro
Suganuma, Katsuaki
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Low temperature Cu sinter joining on different metallization substrates and its reliability evaluation with a high current density

회의자료

issue: 2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2021 33rd International Symposium on. :387-390 May, 2021
Author: Chen, Chuantong
Iwaki, Aya
Suetake, Aiji
Sugiura, Kazuhiko
Kanie, Kiyoshi
Suganuma, Katsuaki
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Real-time monitoring and diagnosis of die attach structure deterioration by using acoustic emission method

회의자료

issue: 2022 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2022 International Conference on. :91-92 May, 2022
Author: Zhang, Zheng
Suetake, Aiji
Chen, Chuantong
Katayama, Osamu
Ishino, Hiroshi
Endo, Takeshi
Sugiura, Kazuhiko
Tsuruta, Kazuhiro
Suganuma, Katsuaki
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

High Temperature Resistant Packaging Technology for SiC Power Module by Using Ni Micro-Plating Bonding

회의자료

issue: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :1451-1456 May, 2019
Author: Tatsumi, Kohei
Morisako, Isamu
Wada, Keiko
Fukuomori, Minoru
Iizuka, Tomonori
Sato, Nobuaki
Shimizu, Koji
Ueda, Kazutoshi
Hikita, Masayuki
Kamimura, Rikiya
Kawanabe, Naoki
Sugiura, Kazuhiko
Tsuruta, Kazuhiro
Toda, Keiji
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Development and evaluation of SiC inverter using Ni micro plating bonding power module

회의자료

issue: 2019 IEEE International Workshop on Integrated Power Packaging (IWIPP) Integrated Power Packaging (IWIPP), 2019 IEEE International Workshop on. :36-39 Apr, 2019
Author: Kawagoe, Akihiro
Itose, Tomoya
Imakiire, Akihiro
Kozako, Masahiro
Hikita, Masayuki
Tatsumi, Kohei
Iizuka, Tomonori
Morisako, Isamu
Sato, Nobuaki
Shimizu, Koji
Ueda, Kazutoshi
Sugiura, Kazuhiko
Tsuruta, Kazuhiro
Toda, Keiji
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Metallization technology of SiC power module in high temperature operation

회의자료

issue: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :371-374 Apr, 2018
Author: Iwashige, Tomohito
Sugiura, Kazuhiko
Endo, Takeshi
Tsuruta, Kazuhiko
Sakuma, Yuichi
Kurosaka, Seigo
Oda, Yukinori
Chen, Chuantong
Nagao, Shijo
Suganuma, Katsuaki
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Effect of pre-annealing of Au metallization structure on the bonding performance with low temperature pressureless sintering Ag

회의자료

issue: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :116-120 Apr, 2018
Author: Chen, Chuantong
Zhang, Zheng
Nagao, Shijo
Suganuma, Katsuaki
Iwashige, Tomohito
Sugiura, Kazuhiko
Tsuruta, Kazuhiro
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Prominent interface structure and bonding material of power module for high temperature operation

회의자료

issue: 2017 29th International Symposium on Power Semiconductor Devices and IC's (ISPSD) Power Semiconductor Devices and IC's (ISPSD), 2017 29th International Symposium on. :491-494 May, 2017
Author: Sugiura, Kazuhiko
Iwashige, Tomohito
Kawai, Jun
Tsuruta, Kazuhiro
Chen, Chuantong
Nagao, Shijo
Zhang, Hao
Sugahara, Tohru
Suganuma, Katsuaki
Kurosaka, Seigo
Sakuma, Yuichi
Oda, Yukinori
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

First failure point of a SiC power module with sintered Ag die-attach on reliability tests

회의자료

issue: 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :97-100 Apr, 2017
Author: Sugiura, Kazuhiko
Iwashige, Tomohito
Tsuruta, Kazuhiro
Chen, Chuantong
Nagao, Shijo
Zhang, Hao
Sugahara, Tohru
Suganuma, Katsuaki
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Effect of size and shape of Ag particles for mechanical properties of sintered Ag joints evaluated by micro-compression test

회의자료

issue: 2017 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2017 International Conference on. :130-134 Apr, 2017
Author: Chen, Chuantong
Nagao, Shijo
Sugahara, Tohru
Zhang, Hao
Jiu, Jinting
Suganuma, Katsuaki
Iwashige, Tomohito
Sugiura, Kazuhiko
Tsuruta, Kazuhiro
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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