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1
Leakage current based Thermal Design Approach for SSD Reliability 미리보기

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issue
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024
Author
Nallavelli, Ramesh
Nune, Prasad N V
Yarragunta, Suresh Reddy
Glancey, Christopher
Kumar, Gokul
Ong, Yeow Chon
Ng, Hong Wan
DB Label
Database : IEEE Xplore Digital Library
원문보기
2
Significance of Die Shadow Size and Placement on Solder Joint Reliability Performance 미리보기

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issue
2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) Electron Devices Technology & Manufacturing Conference (EDTM), 2024 8th IEEE. :1-3 Mar, 2024
Author
Korpati, Bhaskar Rao
Nune, Prasad N V
Sinha, Koustav
Glancey, Christopher
Kumar, Gokul
Ong, Yeow Chon
Ng, Hong Wan
DB Label
Database : IEEE Xplore Digital Library
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3
Investigation on Underfill Properties Effect on Board Level Solder Joint Reliability for SiP Package 미리보기

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issue
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :705-709 Dec, 2023
Author
Che, Fa Xing
Ong, Yeow Chon
Pan, Ling
Chen, Wren
Yu, Wei
Ng, Hong Wan
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE) 
4
Integration of Artificial Neural Network and Finite Element Simulation for Package Warpage Prediction 미리보기

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issue
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :926-931 Dec, 2023
Author
Panigrahy, Sunil Kumar
Xing Che, Fa
Ong, Yeow Chon
Nagavenkata Nune, Prasad
Ng, Hong Wan
DB Label
Database : IEEE Xplore Digital Library
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Full Text (IEEE) 
5
Methodology of Artificial Intelligence Aided Hybrid Modeling for Predicting Solder Joint Reliability of BGA Package 미리보기

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issue
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1200-1204 May, 2023
Author
Pan, Ling
Che, Faxing
Ong, Yeow Chon
Ng, Hong Wan
Glancey, Christopher
Kumar, Gokul
DB Label
Database : IEEE Xplore Digital Library
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Full Text (IEEE) 
6
Physics-driven Regression Algorithm on Solder Joint Fatigue Life Prediction for Mobile SiP Packages 미리보기

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issue
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :420-425 May, 2023
Author
Che, Fa Xing
Ong, Yeow Chon
Ng, Hong Wan
Pan, Ling
Sinha, Koustav
Glancey, Christopher
Kumar, Gokul
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE) 
7
Substrate Copper Trace Crack Characterization and Simulation 미리보기

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issue
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :699-705 May, 2023
Author
Yu, Wei
Che, Faxing
Liu, Vance
Lin, Milly
Lin, Jay
Rumsey, Brad
Glancey, Christopher
Ong, Yeow Chon
Ng, Hong Wan
DB Label
Database : IEEE Xplore Digital Library
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Full Text (IEEE) 
8
Study on Substrate Crack through Experiment and Simulation on SSD BGA under Temperature Cycling 미리보기

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issue
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :694-698 Dec, 2022
Author
Yu, Wei
Che, Faxing
Ong, Yeow Chon
Ng, Hong Wan
DB Label
Database : IEEE Xplore Digital Library
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Full Text (IEEE) 
9
Partial Underfill Impact Study on Solder Joint Reliability in Smartphone Application 미리보기

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issue
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :668-672 Dec, 2022
Author
Pan, Ling
Che, Fa Xing
Ong, Yeow Chon
Ng, Hong Wan
Sinha, Koustav
Chen, Wren
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE) 
10
Effect of Printed Circuit Board Design Parameters on Solder Joint Reliability for Memory Packages 미리보기

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issue
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2022 IEEE 24th. :622-626 Dec, 2022
Author
Sinha, Koustav
Glancey, Christopher
Chen, Wren
Yang, Pluck
Pan, Ling
Che, Fa Xing
Ong, Yeow Chon
Ng, Hong Wan
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE) 
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