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- ieee electron device letters, electron device letters, ieee, ieee electron device lett. (1)
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- ieee transactions on components, packaging and manufacturing technology, components, packaging and manufacturing technology, ieee transactions on, ieee trans. compon., packag. manufact. technol. (1)
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출판물 검색결과(총 1건)

1. J. Cleaveland revived Poems, orations, epistles, and other of his incomparable pieccs [sic] : with some other exquisite remains of most eminent wits of both the universities that were his contemporaries : this fourth edition, besides many other never before publisht additions, is enriched with the authors Midsummer-Moon, or Lunacy-Rampant : being an university charter, a short survey of some of t

전문(Full Text) 제공 DB / 패키지 :

Early English Books Online (EEBO) ProQuest 1668)

펼치기 닫기

Effect of surface pad finish on fracture mode of flip chip package under electro-migration

회의자료

issue: 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2012 IEEE 14th. :681-684 Dec, 2012
Author: Lee, J. H.
Kim, J. Y.
Hong, S. J.
Moon, J. T.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Free-air ball formation and deformability with Pd coated Cu wire

회의자료

issue: 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2011 IEEE 61st. :1516-1522 May, 2011
Author: Rezvani, A.
Mayer, M.
Shah, A.
Zhou, N.
Hong, S. J.
Moon, J. T.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds

학술저널

issue: IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 3(12):2029-2036 Dec, 2013
Author: McCracken, M. J.
Koda, Y.
Kim, H. J.
Mayer, M.
Persic, J.
Hwang, J. S.
Moon, J.-T.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR)

Concurrent Optimization of Crescent Bond Pull Force and Tail Breaking Force in a Thermosonic Cu Wire Bonding Process

학술저널

issue: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 32(3):157-163 Jul, 2009
Author: Lee, J.
Mayer, M.
Zhou, Y.
Hong, S. J.
Moon, J. T.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - SCOPUS

Low-Stress Thermosonic Copper Ball Bonding

학술저널

issue: IEEE Transactions on Electronics Packaging Manufacturing IEEE Trans. Electron. Packag. Manufact. Electronics Packaging Manufacturing, IEEE Transactions on. 32(3):176-184 Jul, 2009
Author: Shah, A.
Mayer, M.
Zhou, Y. N.
Hong, S. J.
Moon, J. T.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - SCOPUS

Design and Fabrication of 1.25-Gb/s Full-Triplex Transceiver Module With PLC on a Lossy Si Substrate for G/E-PONs

학술저널

issue: Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 27(6):679-687 Mar, 2009
Author: Kim, S.
Eom, Y.-S.
Lee, C.-W.
Baek, Y.
Moon, J.-T.
Kang, K.-Y.
Lee, H.-Y.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (OSA) Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR) 원문복사신청 - FRIC

Integration and Characteristics of 40-Gb/s Electroabsorption Modulator Integrated Laser Module With a Driver Amplifier and Bias Tees

학술저널

issue: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(4):855-860 Nov, 2008
Author: Yun, H.-G.
Choi, K.-S.
Kwon, Y.-H.
Choe, J.-S.
Moon, J.-T.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - SCOPUS 원문복사신청 - FRIC

The influence of substrate junctions on notch formation in the etching of storage stack polysilicon

회의자료

issue: 1998 3rd International Symposium on Plasma Process-Induced Damage (Cat. No.98EX100) Plasma process-induced damage Plasma Process-Induced Damage, 1998 3rd International Symposium on. :112-115 1998
Author: Kang, C.-J.
Jeong, H.-S.
Shin, K.-S.
Moon, J.-T.
Lee, M.-Y.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Fabrication and Characteristics of 40-Gb/s Traveling-Wave Electroabsorption Modulator-Integrated DFB Laser Modules

학술저널

issue: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(2):351-356 May, 2008
Author: Yun, H.-G.
Choi, K.-S.
Kwon, Y.-H.
Choe, J.-S.
Moon, J.-T.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - SCOPUS 원문복사신청 - FRIC

System-on-Packaging with Electroabsorption Modulator for a 60-GHz Band Radio-Over-Fiber Link

학술저널

issue: IEEE Transactions on Advanced Packaging IEEE Trans. Adv. Packag. Advanced Packaging, IEEE Transactions on. 31(1):163-169 Feb, 2008
Author: Choi, K.-S.
Chung, Y.-D.
Jun, D.-S.
Moon, J.-T.
Kim, J.
Yu, H.-K.
Park, H.-H.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - SCOPUS 원문복사신청 - FRIC

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