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- components, circuits, devices and systems (32)
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- frequency (21)
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- ieee transactions on advanced packaging, advanced packaging, ieee transactions on, ieee trans. adv. packag. (6)
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- ieee transactions on advanced packaging, advanced packaging, ieee transactions on, ieee trans. adv. packag. (6)
- electronics letters (4)
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- 2002 ieee international solid-state circuits conference. digest of technical papers (cat. no.02ch37315), solid-state circuits conference, 2002. digest of technical papers. isscc. 2002 ieee international, solid-state circuits conference (2)
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- [1992 proceedings] electrical performance of electronic packaging, electrical performance of electronic packaging, 1992 (1)
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- 2000 proceedings. 50th electronic components and technology conference (cat. no.00ch37070), electronic components & technology conference, 2000. 2000 proceedings. 50th, electronic components and technology (1)
- 2002 ieee 11th topical meeting on electrical performance of electronic packaging, electrical performance of electronic packaging, 2002 ieee 11th topical meeting on, electrical performance of electronic packaging (1)
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- electrical performance of electronic packaging, (1)
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전체선택

Comparison of time- and frequency domain measurement results for product related card and MCM transmission lines up to 65 GHz

회의자료

issue: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Electrical Performance of Electronic Packaging Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on. :21-24 2005
Author: Winkel, T.-M.
Deutsch, A.
Katopis, G.A.
Kopcsay, G.V.
Klink, E.
Dyckman, W.D.
Chamberlin, B.J.
Grabinski, H.
Surovic, C.W.
Liu, H.
Baks, C.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Losses caused by roughness of metallization in printed-circuit boards

회의자료

issue: IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005. Electrical Performance of Electronic Packaging Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on. :39-42 2005
Author: Deutsch, A.
Surovic, C.
Krabbenhoft, R.
Kopcsay, G.V.
Chamberlin, B.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Methodology to simulate delta-I noise interaction with interconnect noise for wide, on-chip data-buses using lossy transmission-line power-blocks

회의자료

issue: Electrical Performance of Electronic Packaging - 2004 Electronic packaging Electrical Performance of Electronic Packaging, 2004. IEEE 13th Topical Meeting on. :295-298 2004
Author: Deutsch, A.
Smith, H.H.
Rubin, B.J.
Krauter, B.L.
Kopcsay, G.V.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Extraction of /spl epsiv/(f) and tan /spl delta/(f) for BT insulator up to 30 GHz using the short-pulse propagation technique

회의자료

issue: Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2003. :235-238 2003
Author: Deutsch, A.
Winkel, T.-M.
Kopcsay, G.V.
Surovic, C.W.
Rubin, B.J.
Katopis, G.A.
Chamberlin, B.J.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Understanding common-mode noise on wide data-buses

회의자료

issue: Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2003. :309-312 2003
Author: Deutsch, A.
Smith, H.H.
Kopcsay, G.V.
Krauter, B.L.
Surovic, C.W.
Elfadel, A.
Widiger, D.J.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Accuracy of dielectric constant measurement using the full-sheet-resonance technique IPC-TM-650 2.5.5.6

회의자료

issue: 2002 IEEE 11th Topical Meeting on Electrical Performance of Electronic Packaging Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on. :311-314 2002
Author: Deutsch, A.
Huber, A.
Kopcsay, G.V.
Rubin, B.J.
Hemedinger, R.
Carey, D.
Becker, W.
Winkel, T.-M.
Chamberlin, B.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Bandwidth prediction for high-performance interconnections

회의자료

issue: 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070) Electronic components and technology Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th. :256-266 2000
Author: Deutsch, A.
Kopcsay, G.V.
Coteus, P.W.
Surovic, C.W.
Dahlenz, P.
Heckmann, D.L.
Duan, D.W.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Multi-line crosstalk and common-mode noise analysis

회의자료

issue: IEEE 9th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.00TH8524) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 2000, IEEE Conference on.. :317-320 2000
Author: Deutsch, A.
Smith, H.H.
Kopcsay, G.V.
Krauter, B.L.
Surovic, C.W.
Coteus, P.W.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

On-chip wiring design challenges for GHz operation

회의자료

issue: IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1999. :45-48 1999
Author: Deutsch, A.
Smith, H.
Kopcsay, G.V.
Edelstein, D.C.
Coteus, P.W.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Frequency-dependent crosstalk modeling for on-chip interconnections

회의자료

issue: IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370) Electrical performance of electronic packaging Electrical Performance of Electronic Packaging, 1998. IEEE 7th Topical Meeting on. :35-38 1998
Author: Deutsch, A.
Smith, H.
Surovic, C.W.
Kopcsay, G.V.
Webber, D.A.
Katopis, G.A.
Becker, W.D.
Coteus, P.W.
Dansky, A.H.
Sai-Halasz, G.A.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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