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전체선택

High Thermal Solution for 3D Integration Package

회의자료

issue: 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2023 IEEE 25th. :1026-1029 Dec, 2023
Author: Chen, Ching Chia
Kao, Nicholas
Wang, Yu Po
Lin, Shane
Li, Yung Ta
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Innovative Fan-Out Embedded Bridge Structure for Co-Packaged Optics

회의자료

issue: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :228-232 May, 2023
Author: Li, Jay
Hsu, Terry
Zhuan, Ming-Han
Lin, Sam
Shih, Teny
Kao, Nicholas
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

3DIC Stacking Process Investigation by Soldering Bonding Technology

회의자료

issue: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :1121-1125 May, 2022
Author: Li, Jay
Jhen Chen, Wei
Lin, Joe
Hsuan Chan, Mu
Lo, Tank
Xu, Bruce
Yih Hung, Liang
Kao, Nicholas
Son Jiang, Don
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Fan-Out Embedded Bridge Solution in HPC Application

회의자료

issue: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :222-225 Dec, 2021
Author: Liu, Shuai-Lin Bradley
Kao, Nicholas
Shih, Teny
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Large Size Multilayered Fan-Out RDL Packaging for Heterogeneous Integration

회의자료

issue: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :239-243 Dec, 2021
Author: Lia, Jay
Tsai, Fang-Lin
Li, Jackson
Pan, George
Chan, Mu-Hsuan
Zheng, Louise
Chen, Steven
Kao, Nicholas
Lai, David
Wan, Katch
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

FCCSP(MUF) Mold-flow Void Risk Prediction with Different Substrate Surface and Bump Height Design

회의자료

issue: 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021
Author: Yen, Freedman
Kao, Nicholas
Lai, David
Wang, Yu Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

High performance FCBGA Package Evaluation and Characterization for the Networking Application

회의자료

issue: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2140-2144 Jun, 2021
Author: Lin, Vito
Kao, Nicholas
Lai, David
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Warpage Assessment of Chip Module in Chip Last FO-MCM Platform for Non-wetting Risk Evaluation

회의자료

issue: 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :68-71 Oct, 2020
Author: Pan, George
Kao, Nicholas
Lai, David
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

3D Micro Bump Interface Enabling Top Die Interconnect to True Circuit Through Silicon Via Wafer

회의자료

issue: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1888-1893 Jun, 2020
Author: Chang, Nistec
Chung, C. Key
Wang, Yu-Po
Lin, C. F.
Su, PJ
Shih, Teny
Kao, Nicholas
Hung, Joe
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Enhance Larger FCBGA Package Evaluation and Characterization

회의자료

issue: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :491-494 Dec, 2019
Author: Lin, Vito
Kao, Nicholas
Lai, David
Jiang, Don Son
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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