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전체선택

Thermally Conductive Polymer Composites with Hexagonal Boron Nitride for Medical Device Thermal Management

회의자료

issue: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-8 Sep, 2023
Author: Duyen Do, Nu Bich
Imenes, Kristin
Aasmundtveit, Knut E.
Nguyen, Hoang-Vu
Andreassen, Erik
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Joint International Master in Smart Systems Integrated Solutions

회의자료

issue: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :310-314 Sep, 2022
Author: Aasmundtveit, Knut E.
Wang, Changhai
Rencz, Marta
Paulasto-Krockel, Mervi
Imenes, Kristin
Desmulliez, Marc P.Y.
Ender, Ferenc
Vuorinen, Vesa
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Microfabrication of biocompatible cuff electrodes for upper-limb neuroprosthesis

회의자료

issue: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :250-253 Sep, 2022
Author: Ramirez-Sarabia, Jairo
Rabbani, Saad
Blystad, Lars-Cyril
Imenes, Kristin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Enabling Low-Temperature Reworkability for Anisotropic Conductive Adhesives

회의자료

issue: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2021 23rd European. :1-5 Sep, 2021
Author: Nguyen, Hoang-Vu
Gonzalez, Lisette Hernandez
Imenes, Kristin
Aasmundtveit, Knut E.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Implantable Interface for an Arm Neuroprosthesis

회의자료

issue: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2021 23rd European. :1-8 Sep, 2021
Author: Imenes, Kristin
Blystad, Lars-Cyril
Marchetti, Luca
Honsvall, Birgitte Kasin
Ohlckers, Per
Rabbani, Saad
Moldovan, Carmen
Ionescu, Octavian
Franti, Eduard
Dascalu, Monica
Dobrescu, Lidia
Dobrescu, Dragos
Barbilian, Adrian
Lascar, Ioan
Oproiu, Ana Maria
Neagu, Tiberiu
Raita, Stefania
Costea, Ruxandra
Carbunaru, Vlad
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Joint International Master in Smart Systems Integrated Solutions

회의자료

issue: 2021 Smart Systems Integration (SSI) Smart Systems Integration (SSI), 2021. :1-4 Apr, 2021
Author: Aasmundtveit, Knut E.
Wang, Changhai
Rencz, Marta
Paulasto-Krockel, Mervi
Imenes, Kristin
Desmulliez, Marc
Ender, Ferenc
Vuorinen, Vesa
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Bidirectional neuroprosthesis system integration

회의자료

issue: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-7 Sep, 2020
Author: Blystad, Lars-Cyril
Ohlckers, Per
Marchetti, Luca
Franti, Eduard
Dascalu, Monica
Ionescu, Octavian
Dobrescu, Dragos
Dobrescu, Lidia
Niculae, Catalin
Dragomir, David Catalin
Kasin Honsvall, Birgitte
Opris, Cristian Ovidiu
Imenes, Kristin
Ion, Marian
Oproiu, Ana Maria
Pascalau, Ana-Maria
Moldovan, Carmen
Firtat, Bogdan
Ristoiu, Violeta
Gheorghe, Roxana
Barbilian, Adrian
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Peel Adhesion and Reworkability of Anisotropic Conductive Adhesive for Flex-to-Flex Assembly in Medical Devices

회의자료

issue: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-7 Sep, 2020
Author: Nguyen, Hoang-Vu
Kristiansen, Helge
Imenes, Kristin
Aasmundtveit, Knut E.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Thermal management with a new encapsulation approach for a medical device

회의자료

issue: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-5 Sep, 2020
Author: Duyen Do, Nu Bich
Andreassen, Erik
Imenes, Kristin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Reworkable Anisotropic Conductive Adhesive for Assembly of Medical Devices

회의자료

issue: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC) European Microelectronics and Packaging Conference & Exhibition (EMPC), 2019 22nd. :1-6 Sep, 2019
Author: Nguyen, Hoang-Vu
Kristiansen, Helge
Lifjeld, Anders
Imenes, Kristin
Aasmundtveit, Knut E.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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