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전체선택

One-Probe Nanoprobing of Power Devices and Electronic Packages

회의자료

issue: 2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC) Microelectronics and Packaging Conference & Exhibition (EMPC), 2023 24th European. :1-5 Sep, 2023
Author: Huang, Chengliang
Viswanathan, Vignesh
Rummel, Andreas
Johnson, Greg M.
Stegmann, Heiko
Andrew, Elliott
Gu, Allen
Terada, Masako
Rodgers, Thomas
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

A Breakthrough in Resolution and Scan Speed: Overcome the Challenges of 3D X-ray Imaging Workflows for Electronics Package Failure Analysis

회의자료

issue: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2023 IEEE International Symposium on the. :1-4 Jul, 2023
Author: Gu, Allen
Krampert, Gerhard
Candell, Susan
Terada, Masako
Rodgers, Thomas
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

From System to Package to Interconnect: An Artificial Intelligence Powered 3D X-ray Imaging Solution for Semiconductor Package Structural Analysis and Correlative Microscopic Failure Analysis

회의자료

issue: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2022 IEEE International Symposium on the. :1-5 Jul, 2022
Author: Gu, Allen
Terada, Masako
Stegmann, Heiko
Rodgers, Thomas
Fu, Chao
Yang, Yanjing
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

A Deep Learning Reconstruction Technique and Workflow to Enhance 3D X-ray Imaging Resolution and Speed for Electronics Package Failure Analysis

회의자료

issue: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :69-70 Apr, 2023
Author: Gu, Allen
Andreyev, Andriy
Terada, Masako
Rodgers, Thomas
Viswanathan, Vignesh
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

A new 3D X-ray solution for non-destructive construction analysis of advanced electronics packages

회의자료

issue: 2021 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2021 IEEE International Symposium on the. :1-4 Sep, 2021
Author: Yang, Yanjing
Gu, Allen
Gregorich, Thom
Terada, Masako
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Non-Destructive 3D Characterization of Application Processor Panel Level Package Used in Galaxy Smartwatch

회의자료

issue: 2019 International Wafer Level Packaging Conference (IWLPC) Wafer Level Packaging Conference (IWLPC), 2019 International. :1-7 Oct, 2019
Author: Gregorich, Thomas
Terada, Masako
Hartfield, Cheryl
Gu, Allen
Vardaman, Jan
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

High-resolution 3D X-ray Microscopy for Structural Inspection and Measurement of Semiconductor Package Interconnects

회의자료

issue: 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2019 IEEE 26th International Symposium on. :1-4 Jul, 2019
Author: Mohammad-Zulkifli, Syahirah
Zee, Bernice
Thomas, Gregorich
Gu, Allen
Yang, YanJing
Masako, Terada
Lee, Weijie
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Putting AI to Work: A Practical and Simple Application to Improve 3D X-ray FA

회의자료

issue: 2022 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2022 IEEE International. :10C.1-1-10C.1-6 Mar, 2022
Author: Harris, William
Gu, Allen
Terada, Masako
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

3D Measurement Workflow for Packaging Development and Production Control Using High-Resolution 3D X-ray Microscope

회의자료

issue: 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :206-210 Dec, 2018
Author: Gu, Allen
Auyoong, John
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

From PCB to BEOL: 3D X-Ray Microscopy for Advanced Semiconductor Packaging

회의자료

issue: 2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Physical and Failure Analysis of Integrated Circuits (IPFA), 2018 IEEE International Symposium on the. :1-7 Jul, 2018
Author: Hartfield, Cheryl
Schmidt, Christian
Gu, Allen
Kelly, Stephen T.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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