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전체선택

Modeling Copper Plastic Deformation and Liner Viscoelastic Flow Effects on Performance and Reliability in Through Silicon Via (TSV) Fabrication Processes

학술저널

issue: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 19(4):642-653 Dec, 2019
Author: Karmarkar, A.P.
Xu, X.
El Sayed, K.
Guo, W.
Van der Plas, G.
Van Huylenbroeck, S.
Gonzalez, M.
Absil, P.
Beyne, E.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR)

Computational analysis of mechanical and electromigration reliability problems

회의자료

issue: 2012 IEEE International Interconnect Technology Conference Interconnect Technology Conference (IITC), 2012 IEEE International. :1-3 Jun, 2012
Author: Avci, I.
Balasingam, P.
Chawla, V.
El-Sayed, K.
Johnson, M. D.
Kucherov, A.
Li, S.
Mishra, B.
Oh, Y.
Polsky, B.
Qin, Z.
Simeonov, S.
Tian, S.
Xu, X.
Zhou, W.
Zhu, M.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Investigation of the Statistical Variability of Static Noise Margins of SRAM Cells Using the Statistical Impedance Field Method

학술저널

issue: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 59(6):1738-1744 Jun, 2012
Author: El Sayed, K.
Wettstein, A.
Simeonov, S. D.
Lyumkis, E.
Polsky, B.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR)

Investigation of Proximity Effects in a 6T SRAM Cell Using Three-Dimensional TCAD Simulations

학술저널

issue: IEEE Transactions on Electron Devices IEEE Trans. Electron Devices Electron Devices, IEEE Transactions on. 58(4):1189-1196 Apr, 2011
Author: Simeonov, S. D.
Avci, I.
Balasingam, P.
Johnson, M. D.
Kucherov, A.
Lyumkis, E.
von Matt, U.
El Sayed, K.
Saha, A. R.
Tan, Z.
Tian, S.
Villablanca, L.
Polsky, B.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE) 등재 - Web of Science (SCIE) 등재 - SCOPUS 조회 - Impact Factor (JCR)

Simulations of ultrathin, ultrashort double-gated MOSFETs with the density gradient transport model

회의자료

issue: International Conference on Simulation of Semiconductor Processes and Devices Simulation of semiconductor processes Simulation of Semiconductor Processes and Devices, 2002. SISPAD 2002. International Conference on. :271-274 2002
Author: Lyumkis, E.
Mickevicius, R.
Penzin, O.
Polsky, B.
El Sayed, K.
Wettstein, A.
Fichtner, W.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Simulations of quantum transport in HEMT using density gradient model

회의자료

issue: 24th Annual Technical Digest Gallium Arsenide Integrated Circuit (GaAs IC) Symposiu Gallium arsenide integrated circuit symposium Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 2002. 24th Annual Technical Digest. :233-236 2002
Author: Lyumkis, E.
Mickevicius, R.
Penzin, O.
Polsky, B.
El Sayed, K.
Wettstein, A.
Fichtner, W.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Numerical analysis of electron tunneling through heterointerfaces and Schottky barriers in heterostructure devices

회의자료

issue: GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuits Symposium. 22nd Annual Technical Digest 2000. (Cat. No.00CH37084) GaAs IC symposium GaAs IC Symposium, 2000. 22nd Annual. :129-132 2000
Author: Lyumkis, E.
Mickevicius, R.
Penzin, O.
Polsky, B.
El Sayed, K.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Simulation of electron tunneling in HEMT devices

회의자료

issue: 2000 IEEE International Symposium on Compound Semiconductors. Proceedings of the IEEE Twenty-Seventh International Symposium on Compound Semiconductors (Cat. No.00TH8498) Compound semiconductors Compound Semiconductors, 2000 IEEE International Symposium on. :179-184 2000
Author: Lyumkis, E.
Mickevicius, R.
Penzin, O.
Polsky, B.
El Sayed, K.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Performance and Reliability Impact of Copper Plasticity in Backside TSV-Last Fabrication Process

학술저널

issue: IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 16(3):402-412 Sep, 2016
Author: Karmarkar, A.P.
Guo, W.
Xu, X.
Van der Plas, G.
Van Huylenbroeck, S.
Gonzalez, M.
Absil, P.
El Sayed, K.
Beyne, E.
DB Label: Database : IEEE Xplore Digital Library