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자료유형
- Academic Journals (44)
- Conference Materials (19)
- Magazines (12)
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Count Name
- Academic Journals (44)
- Conference Materials (19)
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주제
- soldering (18)
- microstructure (16)
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- soldering (18)
- microstructure (16)
- reliability (15)
- components, circuits, devices and systems (13)
- fatigue (9)
- engineered materials, dielectrics and plasmas (8)
- solder joints (8)
- photonics and electrooptics (7)
- solder & soldering (7)
- thermal fatigue (7)
- tin (7)
- reliability in engineering (6)
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- nickel (5)
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- joints (4)
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간행물
- jom: the journal of the minerals, metals & materials society (tms) (9)
- ieee transactions on components, packaging & manufacturing technology (6)
- jom (5)
간행물

Count Name
- jom: the journal of the minerals, metals & materials society (tms) (9)
- ieee transactions on components, packaging & manufacturing technology (6)
- jom (5)
- journal of laser applications (4)
- soldering & surface mount technology (4)
- consumer reports (3)
- ieee transactions on components & packaging technologies (3)
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- 2014 ieee 64th electronic components & technology conference (ectc) (2)
- 2014 ieee 64th electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2014 ieee 64th (2)
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- 2008 33rd ieee/cpmt international electronics manufacturing technology conference (iemt), electronic manufacturing technology symposium (iemt), 2008 33rd ieee/cpmt international (1)
- 2009 59th electronic components and technology conference, electronic components and technology conference, 2009. ectc 2009. 59th (1)
- 2009 european microelectronics and packaging conference, microelectronics and packaging conference, 2009. empc 2009. european (1)
- 2011 ieee 61st electronic components and technology conference (ectc), electronic components and technology conference (ectc), 2011 ieee 61st (1)
- 2012 35th ieee/cpmt international electronics manufacturing technology conference (iemt) (1)
- 2012 35th ieee/cpmt international electronics manufacturing technology conference (iemt), electronic manufacturing technology symposium (iemt), 2012 35th ieee/cpmt international (1)
- 2013 ieee 63rd electronic components & technology conference (1)
- 2013 ieee 63rd electronic components and technology conference, electronic components and technology conference (ectc), 2013 ieee 63rd (1)
- 2015 ieee 65th electronic components & technology conference (ectc) (1)
- 2015 ieee 65th electronic components and technology conference (ectc), electronic components and technology conference (ectc) , 2015 ieee 65th (1)
- 2018 international conference on electronics packaging and imaps all asia conference (icep-iaac), electronics packaging and imaps all asia conference (icep-iaac), 2018 international conference on (1)
- 2018 pan pacific microelectronics symposium (pan pacific), pan pacific microelectronics symposium (pan pacific), 2018 (1)
- 2023 international conference on electronics packaging (icep), electronics packaging (icep), 2023 international conference on (1)
- 2024 pan pacific strategic electronics symposium (pan pacific), pan pacific strategic electronics symposium (pan pacific), 2024 (1)
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- through the eyes of the beholder (1)
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- ieee (23)
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출판사

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- ieee (23)
- springer nature (6)
- springer (5)
- elsevier ltd (4)
- springer us (4)
- consumer reports, inc. (3)
- american institute of physics (2)
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- emerald group publishing limited (2)
- emerald publishing limited (2)
- ieee-inst electrical electronics engineers inc (2)
- international microelectronics & packaging society (2)
- japan institute of electronics packaging (2)
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- english (69)
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- 2011 (4)
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- Complementary Index (22)
- IEEE Xplore Digital Library (13)
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수록데이터베이스

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- Complementary Index (22)
- IEEE Xplore Digital Library (13)
- Business Source Complete (9)
- Science Citation Index Expanded (9)
- Academic Search Complete (8)
- USPTO Patent Grants (6)
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전체선택

In Situ Study of Electromigration in Eutectic Tin-Bismuth Planar Solder Joints

회의자료

issue: 2024 Pan Pacific Strategic Electronics Symposium (Pan Pacific) Pan Pacific Strategic Electronics Symposium (Pan Pacific), 2024. :1-6 Jan, 2024
Author: Singh, Prabjit
Palmer, L.
Hamid, M.
Wassick, T.
Campbell, E.
Aspandiar, R. F.
Franco, B.
Fu, H.
Vasudevan, V.
Allen, A.
Howell, K.
Murayama, K.
Zhang, H.
Lifton, A.
Munson, T.
Middleton, S.
Coyle, Richard
Sarangapani, M.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Electromigration in tin-bismuth planar solder joints

회의자료

issue: 2023 International Conference on Electronics Packaging (ICEP) Electronics Packaging (ICEP), 2023 International Conference on. :201-202 Apr, 2023
Author: Singh, Prabjit
Palmer, L.
Hamid, M.
Wassick, T.
Aspandiar, R. F.
Franco, B.
Fu, H.
Coyle, Richard
Hadian, Faramarz
Vasudevan, V.
Allen, A.
Howell, K.
Murayama, K.
Zhang, H.
Lifton, A.
Ribas, M.
Sarangapani, M.
Munson, T.
Middleton, S.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

보고서

Author: Xu, Yilun
Xian, Jingwei
Stoyanov, Stoyan
Bailey, Chris
Coyle, Richard J.
Gourlay, Christopher M.
Dunne, Fionn P. E.
DB Label: Database : arXiv

원문보기: Open Access (Arxiv)

Mechanistic understanding of microstructural effects on the thermal fatigue resistance of solder joints

학술저널

issue: In Journal of the Mechanics and Physics of Solids June 2024 187
Author: Xu, Yilun
Xian, Jingwei
Coyle, Richard J.
Gourlay, Christopher M.
Dunne, Fionn P.E.
DB Label: Database : ScienceDirect

원문보기: Full Text (ScienceDirect) 조회 - Impact Factor (JCR) 등재 - SCOPUS

iNEMI project on process development of BiSn-based low temperature solder pastes: Part III: Mechanical shock tests on POP BGA assemblies

회의자료

issue: 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), 2018 International Conference on. :13-18 Apr, 2018
Author: Fu, Haley
Radhakrishnan, Jagadeesh
Ribas, Morgana
Aspandiar, Raiyo
Byrd, Kevin
Chen, Jimmy
Cheng, Shunfeng
Chen, Qin
Coyle, Richard
Feng, Sophia
Krmpotich, Mark
Mokler, Scott
Sandy-Smith, Brook
Tang, Kok Kwan
Wu, Greg
Zhang, Anny
Zhen, Wilson
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

iNEMI project on process development of BISN-based low temperature solder pastes — Part II: Characterization of mixed alloy BGA solder joints

회의자료

issue: 2018 Pan Pacific Microelectronics Symposium (Pan Pacific) Pan Pacific Microelectronics Symposium (Pan Pacific), 2018. :1-17 Feb, 2018
Author: Fu, Haley
Aspandiar, Raiyo
Chen, Jimmy
Cheng, Shunfeng
Chen, Qin
Coyle, Richard
Feng, Sophia
Hardin, Bill
Krmpotich, Mark
Mokler, Scott
Radhakrishnan, Jagadeesh
Ribas, Morgana
Sandy-Smith, Brook
Tang, Kok Kwan
Wu, Greg
Zhang, Anny
Zhen, Wilson
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

ETF Share Classes: A Path Forward.

정기출판물

issue: Investment Lawyer. Feb2024, Vol. 31 Issue 2, p13-24. 12p.
Author: Coyle, Richard¹
Pershkow, Barry¹
Warren, Morrison¹
DB Label: Database : Business Source Complete

원문보기: Full Text (원문보기)

Failure mechanism and microstructural evolution of Pb-free solder alloys in thermal cycling tests: Effect of solder composition and Sn grain morphology

회의자료

issue: 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th. :118-126 May, 2015
Author: Arfaei, Babak
Mutuku, Francis
Coyle, Richard
Cotts, Eric
Wilcox, Jim
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

The effect of nickel microalloying on thermal fatigue reliability and microstructure of SAC105 and SAC205 solders

회의자료

issue: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :425-440 May, 2014
Author: Coyle, Richard
Parker, Richard
Arfaei, Babak
Mutuku, Francis
Sweatman, Keith
Howell, Keith
Longgood, Stuart
Benedetto, Elizabeth
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Dependence of solder joint reliability on solder volume, Composition and printed circuit board surface finish

회의자료

issue: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th. :655-665 May, 2014
Author: Arfaei, Babak
Mutuku, Francis
Sweatman, Keith
Lee, Ning-Cheng
Cotts, Eric
Coyle, Richard
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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