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1
Analytical Calculation and Experimental Validation of Litz Wires Axial Thermal Conductivity 미리보기

학술저널

issue
IEEE Transactions on Transportation Electrification IEEE Trans. Transp. Electrific. Transportation Electrification, IEEE Transactions on. 10(1):1167-1179 Mar, 2024
Author
Li, Z.
Xu, Z.
Zhang, F.
Gerada, D.
Guo, R.
Zhang, H.
Corfield, M.
Gerada, C.
Zhang, C.
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
2
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process 미리보기

학술저널

issue
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 21(4):536-543 Dec, 2021
Author
Dai, J.
Li, J.
Agyakwa, P.
Corfield, M.
Johnson, C.M.
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
3
Effective Thermal Conductivity Calculation and Measurement of Litz Wire Based on the Porous Metal Materials Structure 미리보기

학술저널

issue
IEEE Transactions on Industrial Electronics IEEE Trans. Ind. Electron. Industrial Electronics, IEEE Transactions on. 67(4):2667-2677 Apr, 2020
Author
Liu, X.
Gerada, D.
Xu, Z.
Corfield, M.
Gerada, C.
Yu, H.
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
4
Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior 미리보기

학술저널

issue
IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 7(5):734-744 May, 2017
Author
Li, J.
Yaqub, I.
Corfield, M.
Johnson, C.M.
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
6
Electrical Performance and Reliability Characterization of a SiC MOSFET Power Module With Embedded Decoupling Capacitors 미리보기

학술저널

issue
IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 33(12):10594-10601 Dec, 2018
Author
Yang, L.
Li, K.
Dai, J.
Corfield, M.
Harris, A.
Paciura, K.
O Brien, J.
Johnson, C.M.
DB Label
Database : IEEE Xplore Digital Library
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Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
7
Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling 미리보기

학술저널

issue
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 18(2):256-265 Jun, 2018
Author
Dai, J.
Li, J.
Agyakwa, P.
Corfield, M.
Johnson, C.M.
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
8
Unusual Observations in the Wear-Out of High-Purity Aluminum Wire Bonds Under Extended Range Passive Thermal Cycling 미리보기

학술저널

issue
IEEE Transactions on Device and Materials Reliability IEEE Trans. Device Mater. Relib. Device and Materials Reliability, IEEE Transactions on. 10(2):254-262 Jun, 2010
Author
Agyakwa, P. A.
Corfield, M. R.
Li, J. F.
Loh, W.-S.
Liotti, E.
Hogg, S. C.
Johnson, C. M.
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
9
Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure 미리보기

학술저널

issue
IEEE Journal of Emerging and Selected Topics in Power Electronics IEEE J. Emerg. Sel. Topics Power Electron. Emerging and Selected Topics in Power Electronics, IEEE Journal of. 6(1):175-187 Mar, 2018
Author
Zhang, H.
Li, J.
Dai, J.
Corfield, M.
Liu, X.
Liu, Y.
Huang, Z.
Johnson, C.M.
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
10
Built-in Reliability Design of Highly Integrated Solid-State Power Switches With Metal Bump Interconnects 미리보기

학술저널

issue
IEEE Transactions on Power Electronics IEEE Trans. Power Electron. Power Electronics, IEEE Transactions on. 30(5):2587-2600 May, 2015
Author
Li, J.
Castellazzi, A.
Dai, T.
Corfield, M.
Solomon, A.K.
Johnson, C.M.
DB Label
Database : IEEE Xplore Digital Library
원문보기
Full Text (IEEE)  조회 - Impact Factor (JCR)  등재 - Web of Science (SCIE)  등재 - SCOPUS 
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