전남대학교 중앙도서관

Characterizations of micro bump undercuts for chiplets integrated packaging

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issue: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022
Author: Xiang, Min
Ma, Li
Li, Honglei
Jiang, Wei
Chung, C. Key
DB Label: Database : IEEE Xplore Digital Library

Overcome high density substrate shortage by using Fan Out Chip Module

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issue: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2022 23rd International Conference on. :1-4 Aug, 2022
Author: Chung, C. Key
Liu, Luke
Cai, Wuhong
Zhuang, Jiaming
Li, Shangxuan
Shi, Peipei
DB Label: Database : IEEE Xplore Digital Library

Electrical Performances of Fan-Out Embedded Bridge

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issue: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :2030-2034 Jun, 2021
Author: You, JinWei
Li, Jay
Ho, David
Li, Jackson
Zhuang, Ming Han
Lai, David
Chung, C. Key
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

Comparison of 3D Packages with $20 \mu \mathrm{m}$ bump pitch using reflow soldering and thermal compression bonding

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issue: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :481-486 Jun, 2021
Author: Chan, Mu Hsuan
Chuang, Chris
Huang, Yu Lung
Chen, Wei Jhen
Jiang, Don Son
Huang, C.M.
Chung, C. Key
DB Label: Database : IEEE Xplore Digital Library

Highly Thermal Dissipation for Large HPC Package Using Liquid Metal Materials

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issue: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1102-1108 Jun, 2021
Author: Huang, Yu Lung
Chung, C. Key
Lin, C.F.
Yu, Kuo Haw
Lin, Rung Jeng
Hong, Wilson
DB Label: Database : IEEE Xplore Digital Library

Lidless and lidded Flip Chip Packages for Advanced Applications

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issue: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :104-111 Dec, 2020
Author: Refai-Ahmed, Gamal
Wang, Huayan
Ramalingam, Suresh
Karunakaran, Nagadeven
Pan, Ke
Park, SB
Soundarajan, Alegesen
Kanaran, Sreedharan Kelappen
Chung, C. Key
Huang, Yu Lung
DB Label: Database : IEEE Xplore Digital Library

3D Micro Bump Interface Enabling Top Die Interconnect to True Circuit Through Silicon Via Wafer

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issue: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1888-1893 Jun, 2020
Author: Chang, Nistec
Chung, C. Key
Wang, Yu-Po
Lin, C. F.
Su, PJ
Shih, Teny
Kao, Nicholas
Hung, Joe
DB Label: Database : IEEE Xplore Digital Library

Scalable Chiplet package using Fan-Out Embedded Bridge

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issue: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :14-18 Jun, 2020
Author: Lin, Joe
Chung, C. Key
Lin, C. F.
Liao, Ally
Lu, Ying Ju
Shuang Chen, Jia
Ng, Daniel
DB Label: Database : IEEE Xplore Digital Library

LTD PKG. (Liquid Thermal Dissipation Package) Technology

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issue: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2019 14th International. :146-149 Oct, 2019
Author: Huang, Yu Lung
Chung, C. Key
Lin, C.F.
Xu, Bruce
Liao, Yunn Shiuan
DB Label: Database : IEEE Xplore Digital Library

Construction of FO-MCM with C4 Bumps Built First Using Chip Last Assembly Technology

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issue: 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2019 IEEE 69th. :7-13 May, 2019
Author: Hsu, Chih-Hsun
Li, Wen-Yang
Chen, Chi-Jen
Jiang, Yih-Jenn
Tai, Jui-Feng
Lin, Chang-Fu
Chung, C. Key
DB Label: Database : IEEE Xplore Digital Library

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