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전체선택

Design of Single Miniaturized Dielectric Resonant Antenna for Millimeter Wave 5G Application

회의자료

issue: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2023 IEEE 73rd. :1820-1824 May, 2023
Author: Lai, Chia-Chu
Lin, Sam
Shih, Teny
Wang, Yu-Po
Tang, Tom
Tsai, Mike
Chiu, Ryan
Chang, Kevin
Dong, Yu-Chang
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Double Side SiP of Structure Strength Analysis for 5G and Wearable Application

회의자료

issue: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2022 IEEE 72nd. :18-23 May, 2022
Author: Tsai, Mike
Li, Wynn
Ding, Ethan
Chang, Tim
Chang, Kevin
Chang, Karina
He, Eric
Chen, J. Y.
Hsieh, Rios
Chiu, Ryan
Lin, James
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Alternative Low Cost EMI Shielding Solutions on SiP Module for 5G mmWave Applications

회의자료

issue: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :334-338 Dec, 2021
Author: Tsai, Mike
Chiu, Ryan
Lin, James
Jie, Yuan
Lin, Azure
Zheng, Eddie
Tsai, Jason
Lin, Bruce
Tsai, Ming-Fan
Yang, Erico
Chen, J. Y.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Characteristics of work-related spine injury in the USA: a National Trauma Data Bank analysis

학술저널

issue: Acta Neurochirurgica: The European Journal of Neurosurgery. 165(10):3097-3106
Author: Jiang, Sam H.
Nico, Elsa
Bhaskara, Mounika
Patil, Shashank
Edgar, Michael C.
Sadeh, Morteza
Chiu, Ryan G.^{Aff3, Aff4}
Mehta, Ankit I.^{Aff1, Aff2, IDs00701023057312_cor8}
DB Label: Database : Springer Nature Journals

원문보기: 조회 - Impact Factor (JCR) 등재 - Web of Science (SCIE) 등재 - SCOPUS

Heterogeneous Integration of Double Side SiP for IoT and 5G Application

회의자료

issue: 2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :1038-1043 Jun, 2021
Author: Tsai, Mike
Chiu, Ryan
Tsai, Ming-fan
He, Eric
Yang, Erico
Chang, Tim
Chu, Frank
Chen, J. Y.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Highly Integrated Assembly Processes Solutions for Double-Sided-SiP Package

회의자료

issue: 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-5 Sep, 2020
Author: Ma, Bo-Hao
Ho, David
Wang, Yu-Po
Yen, Freedman
Guo, Shawn
Chiu, Ryan
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

EMI Shielding Technology in 5G RF System in Package Module

회의자료

issue: 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :931-937 Jun, 2020
Author: Li, Jay
Tsai, Mike
Chiu, Ryan
He, Eric
Hsieh, Alex
Tsai, Ming-fan
Chu, Frank
Chen, J. Y.
Jian, Shunyu
Chen, Simon
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Innovative Packaging Solutions of 3D Integration and System in Package for IoT/Wearable and 5G Application

회의자료

issue: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :515-518 Dec, 2019
Author: Lian, Frank
Wang, David
Chiu, Ryan
Jiang, Jase
Wang, Yu-Po
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Innovative EMI Shielding Solutions on Advanced SiP Module for 5G Application

회의자료

issue: 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :601-607 Dec, 2019
Author: Tsai, Mike
Chiu, Ryan
He, Eric
Chen, J. Y.
Chu, Frank
Tsai, Jensen
Wang, Yu-Po
Jian, Shunyu
Chen, Simon
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

EMI Shielding Solutions for RF SiP Assembly

회의자료

issue: 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2019 14th International. :46-50 Oct, 2019
Author: Su, James PoYuan
Wang, Yu Po
Tsai, Mike
Chiu, Ryan
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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