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1
Power Module on Copper Lead Frame with Novel Sintering Paste and SnSb solder 미리보기

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2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :302-306 Dec, 2020
Author
Wai, Leong Ching
Yamamoto, Kazunori
Boon, Simon Lim Siak
Yue, Tang Gong
DB Label
Database : IEEE Xplore Digital Library
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2
Fan-Out Packaging with Thin-film Inductors 미리보기

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issue
2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :449-452 Dec, 2020
Author
Boon, Soh Siew
Wee, Ho Soon
Boon, Simon Lim Siak
Siang, Sharon Lim Pei
Singh, Ravinder Pal
Raju, Salahuddin
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Database : IEEE Xplore Digital Library
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3
Comprehensive Design and Analysis of Fan-Out Wafer Level Package 미리보기

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issue
2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2019 IEEE 21st. :107-110 Dec, 2019
Author
Zhang, Xiaowu
Jong, Ming Chinq
Bu, Lin
Lau, Boon Long
Boon, Simon Lim Siak
Siang, Sharon Lim Pei
Han, Yong
Liu, Songlin
Wang, Xiaobai
Andriani, Yosephine
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4
RDL Process Development of MEMS Wafer Level Chip Scale Packaging with Silicon Pillar/CuPd as Through Mold Interconnection 미리보기

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issue
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :898-903 Dec, 2018
Author
Long, Lau Boon
Zhaohui, Chen
Boon, Simon Lim Siak
Siang, Sharon Lim Pei
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Database : IEEE Xplore Digital Library
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5
Development of Antenna on FO-WLP 미리보기

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issue
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2018 IEEE 20th. :504-508 Dec, 2018
Author
Boon, Serine Soh Siew
Wee, David Ho Soon
Yao, Hsiao Hsiang
Boon, Simon Lim Siak
Shan, Sharon Lim Pei
Choong, Chong Ser
Chong, Chai Tai
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Database : IEEE Xplore Digital Library
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