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전체선택

Silver Sintering Application in Packaging Al Metallized Chip onto Au Metallized Substrates

회의자료

issue: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-4 May, 2024
Author: Mysliwiec, Marcin
Pavlov, Krystian
Kisiel, Ryszard
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Thermoelectrical Parameters of SiC PiN Diodes with New Die Attachment Ag Paste

회의자료

issue: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2023 IEEE 29th International Symposium for. :167-172 Oct, 2023
Author: Sandulescu, Corina Mitulescu
Kisiel, Riszard
Mysliwiec, Marcin
Svasta, Paul
Draghici, Florin
Mihailescu, Bogdan
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Die attachment Process Overview for High Power Semiconductors

회의자료

issue: 2023 46th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2023 46th International Spring Seminar on. :1-5 May, 2023
Author: Mysliwiec, Marcin
Kisiel, Ryszard
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Pressureless Direct Bonding of Au Metallized Substrate with Si Chips by Micro-Ag Particles

회의자료

issue: 2022 45th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2022 45th International Spring Seminar on. :1-7 May, 2022
Author: Mysliwiec, Marcin
Kisiel, Ryszard
Pavlov, Krystian
Kruszewski, Miroslaw J.
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Development of SLID Bonding Technology for GaN Assembly Based on Ag Microflakes

회의자료

issue: 2019 42nd International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2019 42nd International Spring Seminar on. :1-5 May, 2019
Author: Mysliwiec, Marcin
Kisiel, Ryszard
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Applying Sintering and SLID Bonding for Assembly of GaN Chips Working at High Temperatures

회의자료

issue: 2018 7th Electronic System-Integration Technology Conference (ESTC) Electronic System-Integration Technology Conference (ESTC), 2018 7th. :1-5 Sep, 2018
Author: Mysliwiec, Marcin
Kisiel, Ryszard
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Influence of thermometric characteristics on accuracy of junction temperature measurements of laboratory made SiC Schottky diodes

회의자료

issue: 2018 Baltic URSI Symposium (URSI) URSI Symposium (URSI), 2018 Baltic. :125-128 May, 2018
Author: Gorecki, Pawel
Gorecki, Krzysztof
Kisiel, Ryszard
Mysliwiec, Marcin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Solid-Liquid Interdiffusion Bonding Based on Au-Sn Intermetallic for High Temperature Applications

회의자료

issue: 2018 41st International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2018 41st International Spring Seminar on. :1-5 May, 2018
Author: Kisiel, Ryszard
Mysliwiec, Marcin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

The Overview of Silicon Carbide Technology: Status, Challenges, Key Drivers, and Product Roadmap

학술저널

issue: MATERIALS; JAN 2025, 18 1, p12 36p.
Author: Kaminski, Maciej
Krol, Krystian
Kwietniewski, Norbert
Mysliwiec, Marcin
Sochacki, Mariusz
Stonio, Bartlomiej
Kisiel, Ryszard
Martychowiec, Agnieszka
Racka-Szmidt, Katarzyna
Werbowy, Aleksander
Zelazko, Jaroslaw
Niedzielski, Piotr
Szmidt, Jan
Strojwas, Andrzej
DB Label: Database : Science Citation Index Expanded

원문보기: Full Text (원문보기) Full Text (원문보기) 등재 - Web of Science 등재 - SCOPUS 조회 - Impact Factor (JCR)

Reliability of copper-based interconnections for power devices

회의자료

issue: 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition Microelectronics and Packaging Conference (EMPC) & Exhibition, 2017 21st European. :1-5 Sep, 2017
Author: Guziewicz, Marek
Pagowska, Karolina
Laszcz, Adam
Mysliwiec, Marcin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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