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Education 5.0: Transforming Engineering Education in the Age of Generative AI

회의자료

issue: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for. :303-308 Oct, 2024
Author: Ciolacu, Monica I.
Marghescu, Cristina
Mihailescu, Bogdan
Sorecau, Mirela
Sorecau, Emil
Bechet, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Considerations regarding environmental testing of a solderless assembly for electronics module

회의자료

issue: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for. :382-385 Oct, 2024
Author: Varzaru, Gaudentiu
Tulea, Roxana
Mihailescu, Bogdan
Branzei, Mihai
Svasta, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

New Evaluation for Thermal Diffusivity of High-Power Devices with Different Packages

회의자료

issue: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for. :309-313 Oct, 2024
Author: Mitulescu, Corina Ruxandra
Codreanu, Norocel
Mares, Marius
Mihailescu, Bogdan
Svasta, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Thermal Diffusivity Investigation of a Heat Pipe

회의자료

issue: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th. :1-6 Sep, 2024
Author: Mitulescu, Corina Ruxandra
Mihailescu, Bogdan
Svasta, Paul
Branzei, Mihai
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Reliable Fabrication Methodology for Consistent Supercapacitor Performance

회의자료

issue: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th. :1-5 Sep, 2024
Author: Burcea, Irina Madalina
Negroiu, Rodica Cristina
Mihailescu, Bogdan
Svasta, Paul
Moise, Madalin Vasile
Marghescu, Cristina
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Realization of Cost-Effective Supercapacitors Utilizing Substitutable Materials

회의자료

issue: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-4 May, 2024
Author: Burcea, Irina Madalina
Negroiu, Rodica Cristina
Mihailescu, Bogdan
Svasta, Paul
Moise, Madalin Vasile
Ionescu, Ciprian
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Thermal Diffusivity Determination of a Semiconductor Device

회의자료

issue: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-4 May, 2024
Author: Mitulescu, Corina Ruxandra
Mihailescu, Bogdan
Branzei, Mihai
Svasta, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Does Industry 5.0 Need an Engineering Education 5.0? Exploring Potentials and Challenges in the Age of Generative AI

회의자료

issue: 2024 IEEE Global Engineering Education Conference (EDUCON) Global Engineering Education Conference (EDUCON), 2024 IEEE. :1-10 May, 2024
Author: Ciolacu, Monica Ionita
Marghescu, Cristina
Mihailescu, Bogdan
Svasta, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Condition Monitoring on Inverters for Enhanced Reliability

회의자료

issue: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2023 IEEE 29th International Symposium for. :162-166 Oct, 2023
Author: Sandulescu, Corina Mitulescu
Mihailescu, Bogdan
Moise, Madalin
Svasta, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Thermoelectrical Parameters of SiC PiN Diodes with New Die Attachment Ag Paste

회의자료

issue: 2023 IEEE 29th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2023 IEEE 29th International Symposium for. :167-172 Oct, 2023
Author: Sandulescu, Corina Mitulescu
Kisiel, Riszard
Mysliwiec, Marcin
Svasta, Paul
Draghici, Florin
Mihailescu, Bogdan
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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