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전체선택

Considerations regarding environmental testing of a solderless assembly for electronics module

회의자료

issue: 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2024 IEEE 30th International Symposium for. :382-385 Oct, 2024
Author: Varzaru, Gaudentiu
Tulea, Roxana
Mihailescu, Bogdan
Branzei, Mihai
Svasta, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Thermal Diffusivity Investigation of a Heat Pipe

회의자료

issue: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2024 IEEE 10th. :1-6 Sep, 2024
Author: Mitulescu, Corina Ruxandra
Mihailescu, Bogdan
Svasta, Paul
Branzei, Mihai
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Thermal Diffusivity Determination of a Semiconductor Device

회의자료

issue: 2024 47th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2024 47th International Spring Seminar on. 2024:1-4 May, 2024
Author: Mitulescu, Corina Ruxandra
Mihailescu, Bogdan
Branzei, Mihai
Svasta, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Measurement of some properties for material qualification in solderless assembly for electronics

회의자료

issue: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2022 IEEE 28th International Symposium for. :181-184 Oct, 2022
Author: Baciu, Florin
Branzei, Mihai
Mihailescu, Bogdan
Varzaru, Gaudentiu
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Investigations on the Robustness of a Solderless Assembled Electronic Module

회의자료

issue: 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2022 IEEE 9th. :141-144 Sep, 2022
Author: Mihailescu, Bogdan
Ionescu, Ciprian
Comeaga, Daniel
Varzaru, Gaudentiu
Branzei, Mihai
Baciu, Florin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Vibration Testing of a Solderless Electronic Module Manufactured by Additive Technique

회의자료

issue: 2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2021 IEEE 27th International Symposium for. :226-229 Oct, 2021
Author: Varzaru, Gaudentiu
Ungurelu, Razvan
Branzei, Mihai
Mihailescu, Bogdan
Ionescu, Ciprian
Svasta, Paul
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

On the Increase of the Current Carrying Capability of the Conductor Tracks Made of Electrically Conductive Adhesives

회의자료

issue: 2021 44th International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2021 44th International Spring Seminar on. :1-6 May, 2021
Author: Gheorghe, Marin
Ionescu, Ciprian
Varzaru, Gaudentiu
Branzei, Mihai
Mihailescu, Bogdan
Gheorghe, Simona
Ungurelu, Razvan
Svasta, Paul Mugur
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Investigations at the Interface of a Multilayer Structure Made of Non-Conductive and Conductive Resins

회의자료

issue: 2020 IEEE 26th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2020 IEEE 26th International Symposium for. :67-70 Oct, 2020
Author: Branzei, Mihai
Ionescu, Ciprian
Mihailescu, Bogdan
Svasta, Paul
Varzaru, Gaudentiu
Ungurelu, Razvan
Gheorghe, Marin
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Electrically Conductive Paste Printed Volume Influence on Bonds Properties

회의자료

issue: 2019 IEEE 25th International Symposium for Design and Technology in Electronic Packaging (SIITME) Design and Technology in Electronic Packaging (SIITME), 2019 IEEE 25th International Symposium for. :198-201 Oct, 2019
Author: Branzei, Mihai
Varzaru, Gaudentiu
Vladescu, Marian
Mihailescu, Bogdan
Plotog, Ioan
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

Mechanical vs. Electrical Properties of Conductive Adhesive Bonds as Function of Operating Temperature

회의자료

issue: 2019 42nd International Spring Seminar on Electronics Technology (ISSE) Electronics Technology (ISSE), 2019 42nd International Spring Seminar on. :1-7 May, 2019
Author: Branzei, Mihai
Svasta, Paul Mugur
Vladescu, Marian
Plotog, Ioan
Mihailescu, Bogdan
Varzaru, Gaudentiu
DB Label: Database : IEEE Xplore Digital Library

원문보기: Full Text (IEEE)

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